F4-3200C16D-32GIS

Aegis DDR4
DDR4-3200 CL16-18-18-38 1.35V
32GB (2x16GB)

Named after the powerful shield of Greek gods, Aegis symbolizes strength and power. The AEGIS DDR4 memory series is designed for PC gaming system upgrades, enabling memory upgrades that your gaming rig deserves. Whether it's FPS, RTS, MOBA, or MMORPG, let AEGIS DDR4 Gaming Memory be the strength of your gaming arsenal!

Check memory compatibility for your motherboard with the RAM Configurator tool, or check the QVL for a list of compatible motherboards with this memory kit.

Product Specification

Memory Type
DDR4
Capacity
32GB (16GBx2)
Multi-Channel Kit
Dual Channel Kit
Tested Speed (XMP/EXPO)
3200 MT/s
Tested Latency (XMP/EXPO)
16-18-18-38
Tested Voltage (XMP/EXPO)
1.35V
Registered/Unbuffered
Unbuffered
Error Checking (ECC)
Non-ECC
SPD Speed (Default)
2133 MT/s
SPD Voltage (Default)
1.20V
Fan Included
No
Warranty
Limited Lifetime
Features
Intel XMP 2.0 (Extreme Memory Profile) Ready
Additional Notes
  • Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure.
  • Prior to enabling XMP, memory kits will boot at default BIOS settings with compatible hardware.
  • For memory kits with XMP, enable XMP/DOCP/A-XMP profile in BIOS to reach the rated potential XMP overclock speed of the memory kit, subject to the use of compatible hardware. Please refer to the "How to Enable XMP/EXPO" guide.
  • Reaching the rated XMP overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used.
  • Usage in any manner inconsistent with manufacturer specifications, warnings, designs, or recommendations will result in lower speeds, system instability, or damage to the system or its components.
  • Memory module height can be found in the FAQ, under the question "How tall are the memory modules?".
  • For product support and related questions, please contact the G.SKILL technical support team via email.

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